Surface Planarization of CdZnTe Wafers: Effect of Slurry Formulation and CMP Processing Parameters on Surface Planarity.

Details

Language :

English

ISSN :

21628769

Volume :

11

Issue :

8

Database :

Complementary Index

Journal :

ECS Journal of Solid State Science & Technology

Publication Type :

Academic Journal

Accession number :

159228106

Full Text :

https://doi.org/10.1149/2162-8777/ac8b35