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引线框架铜带显微组织对电镀镍层性能的影响.
- Source :
- Electroplating & Finishing; 2022, Vol. 41 Issue 17, p1250-1255, 6p
- Publication Year :
- 2022
-
Abstract
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- Subjects :
- COPPER alloys
SURFACE morphology
SURFACE roughness
ELECTROPLATING
MICROSTRUCTURE
Subjects
Details
- Language :
- Chinese
- ISSN :
- 1004227X
- Volume :
- 41
- Issue :
- 17
- Database :
- Complementary Index
- Journal :
- Electroplating & Finishing
- Publication Type :
- Periodical
- Accession number :
- 159366803
- Full Text :
- https://doi.org/10.19289/j.1004-227x.2022.17.010