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引线框架铜带显微组织对电镀镍层性能的影响.

Authors :
王云鹏
莫永达
张嘉凝
白依可
王苗苗
娄花芬
Source :
Electroplating & Finishing; 2022, Vol. 41 Issue 17, p1250-1255, 6p
Publication Year :
2022

Abstract

<i>Copyright of Electroplating & Finishing is the property of Electroplating & Finishing Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)

Details

Language :
Chinese
ISSN :
1004227X
Volume :
41
Issue :
17
Database :
Complementary Index
Journal :
Electroplating & Finishing
Publication Type :
Periodical
Accession number :
159366803
Full Text :
https://doi.org/10.19289/j.1004-227x.2022.17.010