Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process.

MLA

Wang, Ziyang, et al. “Experimental and Numerical Investigation of Residual Stress and Post-Weld-Shift of Coaxial Laser Diodes during the Optoelectronic Packaging Process.” Welding in the World, vol. 67, no. 1, Jan. 2023, pp. 63–76. EBSCOhost, https://doi.org/10.1007/s40194-022-01404-3.

APA

Wang, Z., Zhou, H., Zhou, W., Li, Z., Ju, X., Peng, Y., & Duan, J. (2023). Experimental and numerical investigation of residual stress and post-weld-shift of coaxial laser diodes during the optoelectronic packaging process. Welding in the World, 67(1), 63–76. https://doi.org/10.1007/s40194-022-01404-3

Chicago

Wang, Ziyang, Haibo Zhou, Wangwang Zhou, Zhiqiang Li, Xia Ju, Yichang Peng, and Ji’an Duan. 2023. “Experimental and Numerical Investigation of Residual Stress and Post-Weld-Shift of Coaxial Laser Diodes during the Optoelectronic Packaging Process.” Welding in the World 67 (1): 63–76. doi:10.1007/s40194-022-01404-3.