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Sn3Ag / (001)Cu 微凸点多次回流界面反应及 剪切性能研究.
- Source :
- Electronic Components & Materials; Nov2022, Issue 11, p1228-1235, 8p
- Publication Year :
- 2022
-
Abstract
- <i>Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
Details
- Language :
- Chinese
- ISSN :
- 10012028
- Issue :
- 11
- Database :
- Complementary Index
- Journal :
- Electronic Components & Materials
- Publication Type :
- Academic Journal
- Accession number :
- 161332852
- Full Text :
- https://doi.org/10.14106/j.cnki.1001-2028.2022.0178