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Sn3Ag / (001)Cu 微凸点多次回流界面反应及 剪切性能研究.

Authors :
董 冲
马浩然
袁 航
马海涛
王云鹏
Source :
Electronic Components & Materials; Nov2022, Issue 11, p1228-1235, 8p
Publication Year :
2022

Abstract

<i>Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)

Details

Language :
Chinese
ISSN :
10012028
Issue :
11
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
161332852
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2022.0178