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The Development of a Novel Headspace O 2 Concentration Measurement Sensor for Vials.
- Source :
- Sensors (14248220); Mar2023, Vol. 23 Issue 5, p2438, 10p
- Publication Year :
- 2023
-
Abstract
- In the process of manufacture and transportation, vials are prone to breakage and cracks. Oxygen (O<subscript>2</subscript>) in the air entering vials can lead to the deterioration of medicine and a reduction in pesticide effects, threatening the life of patients. Therefore, accurate measurement of the headspace O<subscript>2</subscript> concentration for vials is crucial to ensure pharmaceutical quality. In this invited paper, a novel headspace oxygen concentration measurement (HOCM) sensor for vials was developed based on tunable diode laser absorption spectroscopy (TDLAS). First, a long–optical–path multi–pass cell was designed by optimizing the original system. Moreover, vials with different O<subscript>2</subscript> concentrations (0%, 5%, 10%, 15%, 20%, and 25%) were measured with this optimized system in order to study the relationship between the leakage coefficient and O<subscript>2</subscript> concentration; the root mean square error of the fitting was 0.13. Moreover, the measurement accuracy indicates that the novel HOCM sensor achieved an average percentage error of 1.9%. Sealed vials with different leakage holes (4, 6, 8, and 10 mm) were prepared to investigate the variation in the headspace O<subscript>2</subscript> concentration with time. The results show that the novel HOCM sensor is non-invasive and has a fast response and high accuracy, with prospects in applications for online quality supervision and management of production lines. [ABSTRACT FROM AUTHOR]
- Subjects :
- STANDARD deviations
VIALS
TUNABLE lasers
SEMICONDUCTOR lasers
METHYL parathion
Subjects
Details
- Language :
- English
- ISSN :
- 14248220
- Volume :
- 23
- Issue :
- 5
- Database :
- Complementary Index
- Journal :
- Sensors (14248220)
- Publication Type :
- Academic Journal
- Accession number :
- 162386393
- Full Text :
- https://doi.org/10.3390/s23052438