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Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments.

Authors :
Bell, John
Redmond, Laura
Carpenter, Kalind
de la Croix, Jean-Pierre
Source :
Journal of Microelectronic & Electronic Packaging; 2022, Vol. 19 Issue 1, p25-38, 14p
Publication Year :
2022

Abstract

Rigid-flex circuit boards are becoming more prevalent as the limits are pushed on the size, mass, and geometry of electronic systems. A key aspect of designing a rigid-flex printed circuit boards (PCB) system is an assessment of the dynamic properties of the PCB and predicting system performance under dynamic loading. Among current modeling methodologies for rigid-flex PCB, a simplified modeling methodology that adequately captures the system dynamics does not exist. This article presents a novel, computationally efficient approach for modeling rigid-flex PCB systems and the calibration of the material models via modal testing. The resulting simplified model is able to capture system frequencies, mode shapes, and representative force-displacement behavior. The proposed methodology is used to model NASA Jet Propulsion Laboratory's Pop-Up Flat Folding Explorer Robot (PUFFER) and assess the sensitivity of a system model to input parameters. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
15514897
Volume :
19
Issue :
1
Database :
Complementary Index
Journal :
Journal of Microelectronic & Electronic Packaging
Publication Type :
Academic Journal
Accession number :
163785244
Full Text :
https://doi.org/10.4071/imaps.1655356