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Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments.
- Source :
- Journal of Microelectronic & Electronic Packaging; 2022, Vol. 19 Issue 1, p25-38, 14p
- Publication Year :
- 2022
-
Abstract
- Rigid-flex circuit boards are becoming more prevalent as the limits are pushed on the size, mass, and geometry of electronic systems. A key aspect of designing a rigid-flex printed circuit boards (PCB) system is an assessment of the dynamic properties of the PCB and predicting system performance under dynamic loading. Among current modeling methodologies for rigid-flex PCB, a simplified modeling methodology that adequately captures the system dynamics does not exist. This article presents a novel, computationally efficient approach for modeling rigid-flex PCB systems and the calibration of the material models via modal testing. The resulting simplified model is able to capture system frequencies, mode shapes, and representative force-displacement behavior. The proposed methodology is used to model NASA Jet Propulsion Laboratory's Pop-Up Flat Folding Explorer Robot (PUFFER) and assess the sensitivity of a system model to input parameters. [ABSTRACT FROM AUTHOR]
- Subjects :
- ELECTRONIC systems
STRUCTURAL dynamics
FINITE element method
ROBOTICS
CALIBRATION
Subjects
Details
- Language :
- English
- ISSN :
- 15514897
- Volume :
- 19
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- Journal of Microelectronic & Electronic Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 163785244
- Full Text :
- https://doi.org/10.4071/imaps.1655356