A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity.

MLA

Zhou, Tianfeng, et al. “A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity.” Micromachines, vol. 14, no. 6, June 2023, p. 1162. EBSCOhost, https://doi.org/10.3390/mi14061162.

APA

Zhou, T., Li, Z., Guo, W., Liu, P., Zhao, B., & Wang, X. (2023). A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity. Micromachines, 14(6), 1162. https://doi.org/10.3390/mi14061162

Chicago

Zhou, Tianfeng, Zhongyi Li, Weijia Guo, Peng Liu, Bin Zhao, and Xibin Wang. 2023. “A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity.” Micromachines 14 (6): 1162. doi:10.3390/mi14061162.