Observation of recombination enhanced defect annealing in 4H–SiC.

We report observation of recombination enhanced defect annealing in 4H–SiC detected by capacitance transient spectroscopy and low temperature photoluminescence (PL). Intrinsic defect centers, created by 160 keV electron irradiation, reduce in concentration after illumination at temperatures much lower than previously reported annealing temperatures of 400 and 800 °C. The effect is observed after both external intense above band gap laser excitation, and with recombination in a forward biased pin diode. PL measurements show that several lines, normally detected after electron irradiation, have almost or entirely disappeared by recombination enhanced annealing at room temperature. From capacitance transient measurements, the annealing enhancement is found to be largest for the HS2 hole trap, while the EH1 and EH3 electron traps also anneal out by recombination enhanced reaction but at a lower rate. [ABSTRACT FROM AUTHOR]