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YOLO-Xray: A Bubble Defect Detection Algorithm for Chip X-ray Images Based on Improved YOLOv5.
- Source :
- Electronics (2079-9292); Jul2023, Vol. 12 Issue 14, p3060, 17p
- Publication Year :
- 2023
-
Abstract
- In the manufacturing of chips, the accurate and effective detection of internal bubble defects of chips is essential to maintain product reliability. In general, the inspection is performed manually by viewing X-ray images, which is time-consuming and less reliable. To solve the above problems, an improved bubble defect detection model YOLO-Xray based on the YOLOv5 algorithm for chip X-ray images is proposed. First, the chip X-ray images are preprocessed by image segmentation to construct the chip X-ray defect dataset, namely, CXray. Then, in the input stage, the K-means++ algorithm is used to re-cluster the CXray dataset to generate the anchors suitable for our dataset. In the backbone network, a micro-scale detection head is added to improve the capabilities for small defect detection. In the neck network, the bi-direction feature fusion idea of BiFPN is used to construct a new feature fusion network based on the improved backbone to fuse the semantic features of different layers. In addition, the Quality Focal Loss function is used to replace the cross-entropy loss function to solve the imbalance of positive and negative samples. The experimental results show that the mean average precision (mAP) of the YOLO-Xray algorithm on the CXray dataset reaches 93.5%, which is 5.1% higher than the original YOLOv5. Meanwhile, the YOLO-Xray algorithm achieves state-of-the-art detection accuracy and speed compared with other mainstream object detection models. This shows the proposed YOLO-Xray algorithm can provide technical support for bubble defect detection in chip X-ray images. The CXray dataset is also open and available at CXray. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 20799292
- Volume :
- 12
- Issue :
- 14
- Database :
- Complementary Index
- Journal :
- Electronics (2079-9292)
- Publication Type :
- Academic Journal
- Accession number :
- 168588152
- Full Text :
- https://doi.org/10.3390/electronics12143060