Research on Stamping Formability and Microstructure of Copper-Containing Antibacterial Stainless Steel.

Finite element simulations and forming limit diagram experiments of cupping tests were used to characterize the stamping formability of copper-containing antimicrobial stainless steels, and electron backscatter diffraction (EBSD) technique was used to characterize the microstructure of the samples at different locations of stamping and forming. The experimental results show that circular cracks appear in the raise sidewall area of the sample, and the simulate locations of the cracks are consistent. The EBSD analysis reveals that the closer to the crack position will continuously produce the proliferation of dislocations, so that the small-angle grain boundaries increase significantly, and higher KAM values exist on local grain boundaries or inside a small number of grains. With the change of stamping displacement, part of the austenite phase transforms into martensitic, the slip deformation continues to increase, and the Cube texture transforms into Brass texture. [ABSTRACT FROM AUTHOR]