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Effect of metal/semiconductor contact size on the annealing parameters of ohmic contract.
- Source :
- Proceedings of SPIE; 7/22/2024, Vol. 12966, p129662A-129662A-7, 1p
- Publication Year :
- 2024
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 12966
- Database :
- Complementary Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Conference
- Accession number :
- 174385875
- Full Text :
- https://doi.org/10.1117/12.3008112