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Polyimides with ultra-low coefficient of thermal expansion derived from diamine containing bisbenzimidazole and bisamide.

Authors :
Fang, Chuyi
Xu, Ke
Li, Tao
Qian, Guangtao
Li, Dandan
Chen, Chunhai
Source :
High Performance Polymers; Jun2024, Vol. 36 Issue 5, p323-333, 11p
Publication Year :
2024

Abstract

To provide polyimide (PI) with high heat resistance and ultra-low coefficient of thermal expansion (CTE) for use in flexible display substrates, a novel diamine with bisbenzimidazole and bisamide groups, namely N,N'-(1H,1'H-[5,5'-bibenzo[d]imidazole]-2,2'-diyl)bis(4-aminobenzamide) (BZBA), was designed and successfully synthesized. Several poly(benzimidazole-amide-imide) (PBIAI) films were prepared by thermal imidization with 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 4,4'-oxydiphthalic anhydride (ODPA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), and 4,4'-(hexafluoroisopropylindene)-diphthalic anhydride (6FDA), respectively. Among them, BZBA-BPDA has a high glass transition temperatures (T <subscript>g</subscript> = 345 °C) while achieving an extremely low coefficients of thermal expansion (CTE = 1.9 ppm K<superscript>−1</superscript>), meeting the processing requirements of polymer flexible substrates in OLED devices. The effects of different dianhydrides on the performance of PBIAIs were compared, providing a meaningful reference for further adjusting the PI molecular structure to meet specific requirements for industrial polymer films. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
09540083
Volume :
36
Issue :
5
Database :
Complementary Index
Journal :
High Performance Polymers
Publication Type :
Academic Journal
Accession number :
177434563
Full Text :
https://doi.org/10.1177/09540083241247490