Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate.

The use of fused silica material is crucial in various scientific applications; however, its chemical inertness and brittle nature pose challenges to machining and fabrication processes. The present study introduced a dynamic plasma flow system for medium-pressure plasma processing of fused silica substrate to address this issue. The results indicate that the new plasma flow system can significantly enhance the material removal rate compared to existing systems, with a 300% increase in material removal rate. Importantly, this process enables a sustained linear material removal rate, essential for long process durations. Despite the higher material removal rate, there is no deterioration in surface finish observed, and in fact, an improvement in surface integrity is noted after plasma processing. Confocal Raman microscopy characterization further confirms this improvement, revealing reduced stress-induced defect peaks compared to a confined plasma system. [ABSTRACT FROM AUTHOR]