Supercritical CO 2 -Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application.

MLA

Kondo, Hikaru, et al. “Supercritical CO 2 -Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application.” Electrochem, vol. 5, no. 2, June 2024, pp. 213–22. EBSCOhost, https://doi.org/10.3390/electrochem5020013.

APA

Kondo, H., Kurioka, T., Chiu, W.-T., Chen, C.-Y., Wu, J.-Y., Chang, T.-F. M., Yamaguchi, M., Kurosu, H., & Sone, M. (2024). Supercritical CO 2 -Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application. Electrochem, 5(2), 213–222. https://doi.org/10.3390/electrochem5020013

Chicago

Kondo, Hikaru, Tomoyuki Kurioka, Wan-Ting Chiu, Chun-Yi Chen, Jhen-Yang Wu, Tso-Fu Mark Chang, Machiko Yamaguchi, Hiromichi Kurosu, and Masato Sone. 2024. “Supercritical CO 2 -Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application.” Electrochem 5 (2): 213–22. doi:10.3390/electrochem5020013.