Interference Lithography‐Based Fabrication of 3D Metallic Mesostructures on Reflective Substrates using Electrodeposition‐Compatible Anti‐Reflection Coatings for Power Electronics Cooling (Adv. Electron. Mater. 8/2024).

In the article "Interference Lithography-Based Fabrication of 3D Metallic Mesostructures on Reflective Substrates using Electrodeposition-Compatible Anti-Reflection Coatings for Power Electronics Cooling," published in Advanced Electronic Materials, the authors explore the use of nanostructured copper oxide (nCO) coatings to improve cooling efficiency. These coatings allow for intricate interference lithography processes on reflective semiconductor substrates, enabling the electrodeposition of mesostructured metals. The mesostructured coatings demonstrate significant improvements in heat flux and heat transfer coefficient compared to conventional systems, particularly in the context of power electronics cooling. The findings of this study have the potential to impact the field of power electronics cooling. [Extracted from the article]