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IEEE Transactions on Semiconductor Manufacturing Information for Authors.

Source :
IEEE Transactions on Semiconductor Manufacturing; Aug2024, Vol. 37 Issue 3, pC3-C3, 1p
Publication Year :
2024

Abstract

The "IEEE Transactions on Semiconductor Manufacturing" is a journal that publishes the latest advancements in the manufacturing of microelectronic and photonic components. It aims to enhance knowledge and improve manufacturing practices in the semiconductor industry. The journal covers various topics such as process integration, manufacturing equipment performance, yield analysis, metrology, and supply chain management. Papers submitted to the journal should focus on practical engineering techniques for solving manufacturing-related problems. The journal follows a peer review process and encourages authors from low-income countries to submit their work. The standard length for regular papers is eight pages, with longer manuscripts incurring additional charges. The journal also accepts short communications in the form of letters. Authors are required to follow specific style guidelines for manuscripts and illustrations. The review process takes an average of four to six weeks, and the reviewers' comments are confidential. The journal also accepts graphical abstracts and electronic supplements. Authors are responsible for preparing a publication-quality manuscript and may seek English language editing services. Plagiarism is strictly prohibited, and manuscripts found to have plagiarized content may be penalized. All authors are required to have an Open Researcher and Contributor ID (ORCID). The journal offers both traditional and open access publication options, with associated fees. Native language author names are supported, and page charges may apply. The IEEE owns the copyright to the published material. [Extracted from the article]

Details

Language :
English
ISSN :
08946507
Volume :
37
Issue :
3
Database :
Complementary Index
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
179034343
Full Text :
https://doi.org/10.1109/TSM.2024.3434277