Back to Search Start Over

Optimization of Thermoelectric Properties and Physical Mechanisms of Cu 2 Se-Based Thin Films via Heat Treatment.

Authors :
Li, Haobin
Li, Fu
Chen, Yuexing
Liang, Guangxing
Luo, Jingting
Wei, Meng
Zheng, Zhi
Zheng, Zhuanghao
Source :
Nanomaterials (2079-4991); Sep2024, Vol. 14 Issue 17, p1421, 9p
Publication Year :
2024

Abstract

Cu<subscript>2</subscript>Se is an attractive thermoelectric material due to its layered structure, low cost, environmental compatibility, and non-toxicity. These traits make it a promising replacement for conventional thermoelectric materials in large-scale applications. This study focuses on preparing Cu<subscript>2</subscript>Se flexible thin films through in situ magnetron sputtering technology while carefully optimizing key preparation parameters, and explores the physical mechanism of thermoelectric property enhancement, especially the power factor. The films are deposited onto flexible polyimide substrates. Experimental findings demonstrate that films grown at a base temperature of 200 °C exhibit favorable performance. Furthermore, annealing heat treatment effectively regulates the Cu element content in the film samples, which reduces carrier concentration and enhances the Seebeck coefficient, ultimately improving the power factor of the materials. Compared to the unannealed samples, the sample annealed at 300 °C exhibited a significant increase in room temperature Seebeck coefficient, rising from 9.13 μVK<superscript>−1</superscript> to 26.73 μVK<superscript>−1</superscript>. Concurrently, the power factor improved from 0.33 μWcm<superscript>−1</superscript>K<superscript>−2</superscript> to 1.43 μWcm<superscript>−1</superscript>K<superscript>−2</superscript>. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20794991
Volume :
14
Issue :
17
Database :
Complementary Index
Journal :
Nanomaterials (2079-4991)
Publication Type :
Academic Journal
Accession number :
179645452
Full Text :
https://doi.org/10.3390/nano14171421