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击穿法降低 3D 电子封装侧壁布线接触电阻的研究.

Authors :
奚 锐
王 旭
王心语
董显平
李 明
Source :
Electronic Components & Materials; Aug2024, Vol. 43 Issue 8, p980-987, 8p
Publication Year :
2024

Abstract

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Details

Language :
Chinese
ISSN :
10012028
Volume :
43
Issue :
8
Database :
Complementary Index
Journal :
Electronic Components & Materials
Publication Type :
Academic Journal
Accession number :
180142925
Full Text :
https://doi.org/10.14106/j.cnki.1001-2028.2024.1589