Rapid fabrication of gold microsphere arrays with stable deep-pressing anisotropic conductivity for advanced packaging.

Smooth metal microspheres with uniform sizes are ideal for constructing particle-arrayed anisotropic conductive films (ACF), but synthesis is hindered by challenges in controlling anisotropic metal growth. Here, we present a positioned transient-emulsion self-assembly and laser-irradiation strategy to fabricate pure gold microsphere arrays with smooth surfaces and uniform sizes. The fabrication involves assembling gold nanoparticles into uniform colloidosomes within a pre-designed microhole array, followed by rapid transformation into well-defined microspheres through laser heating. The gold nanoparticles melt and merge in a layer-by-layer manner due to the finite skin depth of the laser, leading to a localized photothermal effect. This strategy circumvents anisotropic growth, enables tunable control of microsphere size and positioning, and is compatible with conventional lithography. Importantly, these pure gold microspheres exhibit stable conductivity under deep compression, offering promising applications in soldering micro-sized chips onto integrated circuits. The authors present a simple and rapid way for fabricating gold microsphere arrays through a laser-irradiated ripening strategy. These gold microspheres are suitable for reliable high-resolution bonding applications due to their stable conductivity. [ABSTRACT FROM AUTHOR]