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TSMC, GlobalFoundries Finish Talks Over Billions in Chips Awards.
- Source :
- Bloomberg.com; 11/6/2024, pN.PAG-N.PAG, 1p
- Publication Year :
- 2024
-
Abstract
- TSMC and GlobalFoundries have finalized agreements for billions of dollars in grants and loans to support US factories, as part of the Chips and Science Act. The exact timing of the agreements and incentives remains uncertain, but the award amounts are consistent with earlier announcements. TSMC's package includes $6.6 billion in grants and up to $5 billion in loans for semiconductor factories in Phoenix, while GlobalFoundries' agreement involves $1.5 billion in grants and up to $1.6 billion in loans for a new plant in New York and expansions in Vermont. The Commerce Department, TSMC, and GlobalFoundries have not provided comments on the matter. [Extracted from the article]
Details
- Language :
- English
- Database :
- Complementary Index
- Journal :
- Bloomberg.com
- Publication Type :
- Periodical
- Accession number :
- 180695024