Balancing thermal conductivity, dielectric, and tribological properties in polyamide 1010 with 2D nanomaterials.

Low electrical conductivity and high heat dissipation are crucial for electronic packaging materials. Additionally, friction is critical for the lifespan and energy efficiency of components. To address these requirements, polymer nanocomposites based on bio‐based polyamide 1010 and ultra‐low contents of 2D nanomaterials were produced by melt‐blending. Graphene oxide, hexagonal boron nitride, and molybdenum disulfide were selected for their two‐dimensional structure and electrical insulation, providing high thermal conductivity while preserving the polymer's dielectric nature. Hybrid nanocomposites were also produced to explore potential synergistic effects. Results showed all compositions maintained the polymer's intrinsic dielectric properties. Although the friction coefficient increased slightly compared with neat polyamide, all nanocomposites remained within the low‐friction range required for low‐friction materials. Thermal conductivity improved by 5%–10% compared with unfilled polyamide, with hybrid systems performing slightly better, indicating a minor synergistic effect. Despite these enhancements being modest compared with the literature, achieving high thermal conductivity usually requires over 20 wt% of nanofiller, which is detrimental to mechanical performance. In this study, at most 0.5 wt% was used, with composites being obtained directly through melt‐blending. This highlights their potential as low‐content additives for thermal interface materials without compromising other essential properties. [ABSTRACT FROM AUTHOR]