Back to Search
Start Over
EIC PROFILE.
- Source :
- IEEE Electrical Insulation Magazine; May/Jun2006, Vol. 22 Issue 3, p36-37, 2p, 4 Color Photographs
- Publication Year :
- 2006
-
Abstract
- The article presents a corporate profile of TechImp Systems Srl, a small Italian company established as an academic spin-off by a group of professors and researchers from the Department of Electrical Engineering of the University of Bologna. The main objective of the company is to provide innovative products and services for the diagnosis of electrical systems.
Details
- Language :
- English
- ISSN :
- 08837554
- Volume :
- 22
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- IEEE Electrical Insulation Magazine
- Publication Type :
- Academic Journal
- Accession number :
- 21171125