Cite
Implantation assisted copper diffusion: A different approach for the preparation of CuInS2/In2S3 p-n junction.
MLA
Wilson, K. C., et al. “Implantation Assisted Copper Diffusion: A Different Approach for the Preparation of CuInS2/In2S3 p-n Junction.” Applied Physics Letters, vol. 89, no. 1, July 2006, p. 013510. EBSCOhost, https://doi.org/10.1063/1.2219135.
APA
Wilson, K. C., Sebastian, T., John, T. T., Sudha Kartha, C., Vijayakumar, K. P., Magudapathi, P., & Nair, K. G. M. (2006). Implantation assisted copper diffusion: A different approach for the preparation of CuInS2/In2S3 p-n junction. Applied Physics Letters, 89(1), 013510. https://doi.org/10.1063/1.2219135
Chicago
Wilson, K. C., Tina Sebastian, Teny Theresa John, C. Sudha Kartha, K. P. Vijayakumar, P. Magudapathi, and K. G. M. Nair. 2006. “Implantation Assisted Copper Diffusion: A Different Approach for the Preparation of CuInS2/In2S3 p-n Junction.” Applied Physics Letters 89 (1): 013510. doi:10.1063/1.2219135.