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MOD Buffer/YB CO Approach to Fabricate Low-Cost Second Generation HTS Wires.
- Source :
- IEEE Transactions on Applied Superconductivity; Jun2007 Part 3 of 3, Vol. 17 Issue 2, p3332-3335, 4p, 2 Diagrams, 3 Graphs
- Publication Year :
- 2007
-
Abstract
- The metal organic deposition (MOD) of buffer layers on RABiTS substrates is considered a potential, low-cost approach to manufacturing high performance Second Generation (2G) high temperature superconducting (HTS) wires. The typical architecture used by American Superconductor in their 2G HTS wire consists of a Ni-W (5 at.%) substrate with a reactively sputtered Y<subscript>2</subscript>O<subscript>3</subscript> seed layer, YSZ barrier layer and a CeO<subscript>2</subscript> cap layer. This architecture supports critical currents of over 300 A/cm-width (77 K, self-field) with 0.8 μm YBCO films deposited by the TFA-MOD process. The main challenge in the development of the MOD buffers is to match or exceed the performance of the standard vacuum deposited buffer architecture. We have recently shown that the texture and properties of MOD - La<subscript>2</subscript>Zr<subscript>2</subscript>O<subscript>7</subscript> (LZO) barrier layers can be improved by inserting a thin sputtered Y<subscript>2</subscript>O<subscript>3</subscript> seed layer and prepared MOD deposited LZO layers followed by MOD or RF sputtered CeO<subscript>2</subscript> cap layers that support MOD-YBCO films with I<subscript>c</subscript>'s of 200 and 255 A/cm-width, respectively. Detailed X-ray and microstructural characterizations indicated that MOD - CeO<subscript>2</subscript> cap reacted completely with MOD YBCO. to form BaCeO<subscript>3</subscript>. However, sputtered CeO<subscript>2</subscript> cap/MOD YBCO interface remains clean. By further optimizing the coating conditions and reducing the heat-treatment temperatures, we have demonstrated an I<subscript>c</subscript> of 336 A/cm with improved LZO layers and sputtered CeO<subscript>2</subscript> cap and exceeded the performance of that of standard vacuum deposited buffers. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 10518223
- Volume :
- 17
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Applied Superconductivity
- Publication Type :
- Academic Journal
- Accession number :
- 26294460
- Full Text :
- https://doi.org/10.1109/TASC.2007.899636