Cite
Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn.
MLA
Chuang, Tung-Han, and Hsiu-Jen Lin. “Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn.” Journal of Electronic Materials, vol. 38, no. 3, Mar. 2009, pp. 420–24. EBSCOhost, https://doi.org/10.1007/s11664-008-0606-1.
APA
Chuang, T.-H., & Lin, H.-J. (2009). Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn. Journal of Electronic Materials, 38(3), 420–424. https://doi.org/10.1007/s11664-008-0606-1
Chicago
Chuang, Tung-Han, and Hsiu-Jen Lin. 2009. “Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn.” Journal of Electronic Materials 38 (3): 420–24. doi:10.1007/s11664-008-0606-1.