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Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders.
- Source :
- Journal of Electronic Packaging; Jun2009, Vol. 131 Issue 2, p021004:1-021004:5, 5p, 3 Diagrams, 3 Graphs
- Publication Year :
- 2009
Details
- Language :
- English
- ISSN :
- 10437398
- Volume :
- 131
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- Journal of Electronic Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 41025077
- Full Text :
- https://doi.org/10.1115/1.3103932