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Spatially confined nickel disilicide formation at 400 degree C on ion implantation....

Authors :
Erokhin, Yu N.
Hong, F.
Source :
Applied Physics Letters; 12/6/1993, Vol. 63 Issue 23, p3173, 3p, 3 Diagrams, 2 Graphs
Publication Year :
1993

Abstract

Investigates the localized formation of continuous silicide layers via solid state reaction of nickel atoms with ion implantation preamorphized silicon. Induction of the silicidation reaction by two stage thermal annealing; Parameters determining the characteristics of the silicide films; Determination of silicide resistivity.

Subjects

Subjects :
SILICIDES
ION implantation
NICKEL

Details

Language :
English
ISSN :
00036951
Volume :
63
Issue :
23
Database :
Complementary Index
Journal :
Applied Physics Letters
Publication Type :
Academic Journal
Accession number :
4177633
Full Text :
https://doi.org/10.1063/1.110214