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Improved direct bonding of Si and SiO[sub 2] surfaces by cleaning in....
- Source :
- Applied Physics Letters; 7/31/1995, Vol. 67 Issue 5, p650, 3p, 1 Chart, 2 Graphs
- Publication Year :
- 1995
-
Abstract
- Presents a method for silicon surface preparation prior to wafer bonding by cleaning in sulphuric peroxide mixture (SPM). Effects of SPM modification on silicon surface; Substitution of fluorine by hydroxide groups as a result of water rinse; Measurement of higher contact wave velocities and bond strengths.
- Subjects :
- SURFACE preparation
SILICON
GEOMETRIC surfaces
Subjects
Details
- Language :
- English
- ISSN :
- 00036951
- Volume :
- 67
- Issue :
- 5
- Database :
- Complementary Index
- Journal :
- Applied Physics Letters
- Publication Type :
- Academic Journal
- Accession number :
- 4241014
- Full Text :
- https://doi.org/10.1063/1.115191