Interfacial Reactions and Microstructures of Sn-0.7Cu- xZn Solders with Ni-P UBM During Thermal Aging.

MLA

Cho, Moon, et al. “Interfacial Reactions and Microstructures of Sn-0.7Cu- XZn Solders with Ni-P UBM During Thermal Aging.” Journal of Electronic Materials, vol. 38, no. 11, Nov. 2009, pp. 2242–50. EBSCOhost, https://doi.org/10.1007/s11664-009-0867-3.

APA

Cho, M., Kang, S. K., Seo, S.-K., Shih, D.-Y., & Lee, H. M. (2009). Interfacial Reactions and Microstructures of Sn-0.7Cu- xZn Solders with Ni-P UBM During Thermal Aging. Journal of Electronic Materials, 38(11), 2242–2250. https://doi.org/10.1007/s11664-009-0867-3

Chicago

Cho, Moon, Sung K. Kang, Sun-Kyoung Seo, Da-Yuan Shih, and Hyuck Mo Lee. 2009. “Interfacial Reactions and Microstructures of Sn-0.7Cu- XZn Solders with Ni-P UBM During Thermal Aging.” Journal of Electronic Materials 38 (11): 2242–50. doi:10.1007/s11664-009-0867-3.