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Composition influence on the physical and electrical properties of SrxTi1-xOy-based metal-insulator-metal capacitors prepared by atomic layer deposition using TiN bottom electrodes.

Authors :
Menou, N.
Popovici, M.
Clima, S.
Opsomer, K.
Polspoel, W.
Kaczer, B.
Rampelberg, G.
Tomida, K.
Pawlak, M. A.
Detavernier, C.
Pierreux, D.
Swerts, J.
Maes, J. W.
Manger, D.
Badylevich, M.
Afanasiev, V.
Conard, T.
Favia, P.
Bender, H.
Brijs, B.
Source :
Journal of Applied Physics; Nov2009, Vol. 106 Issue 9, p094101-1-094101-7, 7p, 1 Color Photograph, 3 Black and White Photographs, 1 Chart, 13 Graphs
Publication Year :
2009

Abstract

In this work, the physical and electrical properties of Sr<subscript>x</subscript>Ti<subscript>1-x</subscript>O<subscript>y</subscript> (STO)-based metal-insulator-metal capacitors (MIMcaps) with various compositions are studied in detail. While most recent studies on STO were done on noblelike metal electrodes (Ru, Pt), this work focuses on a low temperature (250 °C) atomic layer deposition (ALD) process, using an alternative precursor set and carefully optimized processing conditions, enabling the use of low-cost, manufacturable-friendly TiN electrodes. Physical analyses show that the film crystallization temperature, its texture and morphology strongly depends on the Sr/Ti ratio. Such physical variations have a direct impact on the electric properties of Sr<subscript>x</subscript>Ti<subscript>1-x</subscript>O<subscript>y</subscript> based capacitors. It is found that Sr-enrichment result in a monotonous decrease in the dielectric constant and leakage current as predicted by ab initio calculations. The intercept of the EOT vs physical thickness plot further indicates that increasing the Sr-content at the film interface with the bottom TiN would result in lower interfacial equivalent-oxide thickness. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00218979
Volume :
106
Issue :
9
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
45248968
Full Text :
https://doi.org/10.1063/1.3246835