Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints.

MLA

Wen Xue Chen, et al. “Effects of Ag on Microstructures, Wettabilities of Sn–9Zn–xAg Solders as Well as Mechanical Properties of Soldered Joints.” Journal of Materials Science: Materials in Electronics, vol. 21, no. 5, May 2010, pp. 461–67. EBSCOhost, https://doi.org/10.1007/s10854-009-9939-7.

APA

Wen Xue Chen, Song Bai Xue, Hui Wang, Jian Xin Wang, Zong Jie Han, & Li Li Gao. (2010). Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints. Journal of Materials Science: Materials in Electronics, 21(5), 461–467. https://doi.org/10.1007/s10854-009-9939-7

Chicago

Wen Xue Chen, Song Bai Xue, Hui Wang, Jian Xin Wang, Zong Jie Han, and Li Li Gao. 2010. “Effects of Ag on Microstructures, Wettabilities of Sn–9Zn–xAg Solders as Well as Mechanical Properties of Soldered Joints.” Journal of Materials Science: Materials in Electronics 21 (5): 461–67. doi:10.1007/s10854-009-9939-7.