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Effects of rare earth Ce on properties of Sn–9Zn lead-free solder.
- Source :
- Journal of Materials Science: Materials in Electronics; Jul2010, Vol. 21 Issue 7, p719-725, 7p, 7 Diagrams, 1 Chart, 4 Graphs
- Publication Year :
- 2010
-
Abstract
- The influences of different Ce content on the properties of Sn–9Zn lead-free solder were investigated. The results indicate that Ce plays an important role not only in the structure and the solderability, but also in the interfacial structure of Sn–9Zn– xCe/Cu and mechanical property of soldered joint. Sn–9Zn–0.08Ce shows finer and more uniform microstructure than Sn–9Zn, and when the quantity of Ce is 0.5–1 wt%, some dark Sn–Ce compounds appear in the solder. With the addition of 0.08 wt% Ce, the solderability of solder is significantly improved because the surface tension of molten solder is decreased. Adding Ce makes the Cu5Zn8 IMCs formed at the interface of solder/Cu become much thicker than that of Sn–9Zn/Cu because much more content of Zn diffuse to the interface of solder/Cu to react with Cu. Results also indicate that adding 0.08 wt% Ce to the solder enhances mechanical property of soldered joint. When the Ce content is 0.1–0.5 wt%, some hard and brittle Cu–Zn IMCs appear in the bottom of dimples and the pull force of soldered joint decreases. [ABSTRACT FROM AUTHOR]
- Subjects :
- SOLDER & soldering
RARE earth metals
SURFACE chemistry
STEREOLOGY
MICROMECHANICS
Subjects
Details
- Language :
- English
- ISSN :
- 09574522
- Volume :
- 21
- Issue :
- 7
- Database :
- Complementary Index
- Journal :
- Journal of Materials Science: Materials in Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 51039307
- Full Text :
- https://doi.org/10.1007/s10854-009-9984-2