A general Weibull model for reliability analysis under different failure Criteria-application on anisotropic conductive adhesive joining technology.

MLA

Johan Liu, et al. “A General Weibull Model for Reliability Analysis under Different Failure Criteria-Application on Anisotropic Conductive Adhesive Joining Technology.” IEEE Transactions on Electronics Packaging Manufacturing, vol. 28, no. 4, Oct. 2005, pp. 322–27. EBSCOhost, https://doi.org/10.1109/TEPM.2005.856539.

APA

Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh, & Yong Tang. (2005). A general Weibull model for reliability analysis under different failure Criteria-application on anisotropic conductive adhesive joining technology. IEEE Transactions on Electronics Packaging Manufacturing, 28(4), 322–327. https://doi.org/10.1109/TEPM.2005.856539

Chicago

Johan Liu, Liqiang Cao, Min Xie, Thong-Ngee Goh, and Yong Tang. 2005. “A General Weibull Model for Reliability Analysis under Different Failure Criteria-Application on Anisotropic Conductive Adhesive Joining Technology.” IEEE Transactions on Electronics Packaging Manufacturing 28 (4): 322–27. doi:10.1109/TEPM.2005.856539.