Electromigration performance of Pb-free solder joints in terms of solder composition and joining path.

MLA

Seo, Sun-Kyoung, et al. “Electromigration Performance of Pb-Free Solder Joints in Terms of Solder Composition and Joining Path.” JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 62, no. 7, July 2010, pp. 22–29. EBSCOhost, https://doi.org/10.1007/s11837-010-0104-9.

APA

Seo, S.-K., Kang, S., Cho, M., & Lee, H. (2010). Electromigration performance of Pb-free solder joints in terms of solder composition and joining path. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 62(7), 22–29. https://doi.org/10.1007/s11837-010-0104-9

Chicago

Seo, Sun-Kyoung, Sung Kang, Moon Cho, and Hyuck Lee. 2010. “Electromigration Performance of Pb-Free Solder Joints in Terms of Solder Composition and Joining Path.” JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 62 (7): 22–29. doi:10.1007/s11837-010-0104-9.