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Reactive solid-state dewetting of Cu-Ni films on silicon.
- Source :
- Applied Physics Letters; 12/20/2010, Vol. 97 Issue 25, p253101, 3p, 2 Diagrams, 2 Graphs
- Publication Year :
- 2010
-
Abstract
- The behavior of a 50 nm Cu-Ni alloy film on Si in a process of reactive solid-state dewetting is presented. The films were annealed at a range of temperatures (300-700 °C) in 1% H<subscript>2</subscript> 99% N<subscript>2</subscript> reducing atmosphere. The resulting alloy and silicide particles formed by film dewetting and film reaction with the substrate were distinguished by selective wet etching and examined by scanning electron microscopy and spectroscopy. After potassium hydroxide etch, regions that etch slower than silicon substrate have distribution statistics similar to the alloy and silicide particles prior to their removal, indicating strong coupling between mass transport across the interface and along the surface. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00036951
- Volume :
- 97
- Issue :
- 25
- Database :
- Complementary Index
- Journal :
- Applied Physics Letters
- Publication Type :
- Academic Journal
- Accession number :
- 56601019
- Full Text :
- https://doi.org/10.1063/1.3527078