Microstructure formation in electrochemically deposited Copper thin films.

Details

Language :

English

ISSN :

09335137

Volume :

38

Issue :

2

Database :

Complementary Index

Journal :

Materialwissenschaft und Werkstoffechnik

Publication Type :

Academic Journal

Accession number :

62074310

Full Text :

https://doi.org/10.1002/mawe.200600119