Surface modification and metallization of polyimide using gold colloids as a seed layer.

The article reports on the metallization of copper (Cu) on to surface-modified polyimide resin. The method involves potassium hydroxide-induced modification of the polyimide surface to introduce carboxylic acid groups and incorporation of gold colloids as a seed layer. Gold colloids serves as a conductive layer to catalyze the electroless plating of Cu on polyimide surface. The potential of such procedure in the manufacturing of Cu circuit patterns in the microelectronic industry is suggested.