Performance comparison of carbon nanotube, nickel silicide nanowire and copper VLSI interconnectsPerspectives and challenges ahead.

MLA

Duksh, Yograj Singh, et al. “Performance Comparison of Carbon Nanotube, Nickel Silicide Nanowire and Copper VLSI InterconnectsPerspectives and Challenges Ahead.” Journal of Engineering, Design & Technology, vol. 8, no. 3, Nov. 2010, pp. 334–53. EBSCOhost, https://doi.org/10.1108/17260531011086199.

APA

Duksh, Y. S., Kaushik, B. K., Sarkar, S., & Singh, R. (2010). Performance comparison of carbon nanotube, nickel silicide nanowire and copper VLSI interconnectsPerspectives and challenges ahead. Journal of Engineering, Design & Technology, 8(3), 334–353. https://doi.org/10.1108/17260531011086199

Chicago

Duksh, Yograj Singh, Brajesh Kumar Kaushik, Sankar Sarkar, and Raghuvir Singh. 2010. “Performance Comparison of Carbon Nanotube, Nickel Silicide Nanowire and Copper VLSI InterconnectsPerspectives and Challenges Ahead.” Journal of Engineering, Design & Technology 8 (3): 334–53. doi:10.1108/17260531011086199.