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Grain boundary diffusion effects on the sputter depth profiles of Co–Ag bilayers.

Authors :
Lee, Y. S.
Choi, I. S.
Lim, K. Y.
Jeong, K.
Whang, C. N.
Choe, H. S.
Lee, Y. P.
Source :
Journal of Applied Physics; 4/1/1996, Vol. 79 Issue 7, p3534, 7p, 1 Black and White Photograph, 1 Diagram, 5 Graphs
Publication Year :
1996

Abstract

Presents a study which investigated the effects of surface roughness and grain boundary diffusion at elevated temperatures on the Auger-electron-spectroscopy sputter depth profiles of cobalt-silver bilayers and the grain boundary process of silver atoms in cobalt. Introduction to sputter depth profiling; Description of the experimental setup; Results.

Details

Language :
English
ISSN :
00218979
Volume :
79
Issue :
7
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
7658453
Full Text :
https://doi.org/10.1063/1.361405