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Parasitics extraction, wideband modeling and sensitivity analysis of through-strata-via (TSV) in 3D integration/packaging.

Authors :
Zheng Xu
Xiaoxiong Gu
Jian-Qiang Lu
Source :
Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI; 2011, p1-6, 6p
Publication Year :
2011

Details

Language :
English
ISBNs :
9781612844084
Database :
Complementary Index
Journal :
Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI
Publication Type :
Conference
Accession number :
80254099
Full Text :
https://doi.org/10.1109/ASMC.2011.5898175
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