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High temperature lead-free solder joints via mixed powder system.
- Source :
- 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2011, p1-7, 7p
- Publication Year :
- 2011
Details
- Language :
- English
- ISBNs :
- 9781457717703
- Database :
- Complementary Index
- Journal :
- 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
- Publication Type :
- Conference
- Accession number :
- 80299915
- Full Text :
- https://doi.org/10.1109/ICEPT.2011.6066814