Lead-Free Solder Micro-Ball Bumps for the Next Generation of Flip Chip Interconnection: Micro-Ball Materials, Bump Formation Process and Reliability.

Details

Language :

English

ISBNs :

9781424409853

Database :

Complementary Index

Journal :

2007 Proceedings 57th Electronic Components & Technology Conference

Publication Type :

Conference

Accession number :

80945867

Full Text :

https://doi.org/10.1109/ECTC.2007.373901