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Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package.
- Source :
- 2008 10th Electronics Packaging Technology Conference; 2008, p613-619, 7p
- Publication Year :
- 2008
Details
- Language :
- English
- ISBNs :
- 9781424421176
- Database :
- Complementary Index
- Journal :
- 2008 10th Electronics Packaging Technology Conference
- Publication Type :
- Conference
- Accession number :
- 80949812
- Full Text :
- https://doi.org/10.1109/EPTC.2008.4763501