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Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package.

Authors :
Ong, Y.Y.
Vaidyanathan, K.
Ho, S.W.
Sekhar, V.N.
Jong, M.C.
Wai, L.C.
Rao, V.S.
Sheng, V.
Ong, J.
Ong, X.
Zhang, X.
Seung, Y.U.
Lau, J.
Lim, Y.K.
Yeo, D.
Chan, K.C.
Yanfeng, Z.
Tan, J.B.
Sohn, D.K.
Source :
2008 10th Electronics Packaging Technology Conference; 2008, p613-619, 7p
Publication Year :
2008

Details

Language :
English
ISBNs :
9781424421176
Database :
Complementary Index
Journal :
2008 10th Electronics Packaging Technology Conference
Publication Type :
Conference
Accession number :
80949812
Full Text :
https://doi.org/10.1109/EPTC.2008.4763501
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