Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance.

Details

Language :

English

ISBNs :

9781424422302

Database :

Complementary Index

Journal :

2008 58th Electronic Components & Technology Conference

Publication Type :

Conference

Accession number :

80980907

Full Text :

https://doi.org/10.1109/ECTC.2008.4550103