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Application of through mold via (TMV) as PoP base package.
- Source :
- 2008 58th Electronic Components & Technology Conference; 2008, p1089-1092, 4p
- Publication Year :
- 2008
Details
- Language :
- English
- ISBNs :
- 9781424422302
- Database :
- Complementary Index
- Journal :
- 2008 58th Electronic Components & Technology Conference
- Publication Type :
- Conference
- Accession number :
- 80980914
- Full Text :
- https://doi.org/10.1109/ECTC.2008.4550110