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3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation.

Authors :
Bakir, M.S.
King, C.
Sekar, D.
Thacker, H.
Bing Dang
Gang Huang
Naeemi, A.
Meindl, J.D.
Source :
2008 IEEE Custom Integrated Circuits Conference; 2008, p663-670, 8p
Publication Year :
2008

Details

Language :
English
ISBNs :
9781424420186
Database :
Complementary Index
Journal :
2008 IEEE Custom Integrated Circuits Conference
Publication Type :
Conference
Accession number :
81008082
Full Text :
https://doi.org/10.1109/CICC.2008.4672173