Cold welding: A new factor governing the robustness of adhesively bonded flip-chip interconnects.

Details

Language :

English

ISBNs :

9781424444755

Database :

Complementary Index

Journal :

2009 59th Electronic Components & Technology Conference

Publication Type :

Conference

Accession number :

81068277

Full Text :

https://doi.org/10.1109/ECTC.2009.5073998