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Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives.
- Source :
- Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p1176-1180, 5p
- Publication Year :
- 2003
Details
- Language :
- English
- ISBNs :
- 9780780377912
- Database :
- Complementary Index
- Journal :
- Proceedings of the 53rd Electronic Components & Technology Conference, 2003
- Publication Type :
- Conference
- Accession number :
- 81103702
- Full Text :
- https://doi.org/10.1109/ECTC.2003.1216441