Modeling of cure-induced warpage of plastic IC packages.

Authors :: Yang, D.G.
Jansen, K.M.B.
Ernst, L.J.
Zhang, G.Q.
van Driel, W.D.
Bressers, H.J.L.
Source :: Proceedings of the 5th International Conference on Thermal & Mechanical Simulation & Experiments in Microelectronics & Microsystems, 2004. EuroSimE 2004; 2004, p33-40, 8p
Publication Year :: 2004

Language :: English
ISBNs :: 9780780384200
Database :: Complementary Index
Journal :: Proceedings of the 5th International Conference on Thermal & Mechanical Simulation & Experiments in Microelectronics & Microsystems, 2004. EuroSimE 2004
Publication Type :: Conference
Accession number :: 81105170
Full Text :: https://doi.org/10.1109/ESIME.2004.1304019