A novel technique for lead-free soldering process using variable frequency microwave (VFM).

Details

Language :

English

ISBNs :

9780780384361

Database :

Complementary Index

Journal :

2004 Proceedings 9th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces (IEEE Cat. No.04TH8742)

Publication Type :

Conference

Accession number :

81109429

Full Text :

https://doi.org/10.1109/ISAPM.2004.1288001